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HTX-900 Thermal Paste
Advanced Thermal Interface Material
Coolxpert HTX-900 is a thermal interface paste developed for heat-transfer applications in computing and electronic systems. It helps fill microscopic gaps between a heat-generating component and its heat sink to support thermal transfer across the interface.
Designed for Thermal Management
A thermal interface material for applications where heat transfer between a component and heat sink is an important part of system design.
Thermal Transfer
Specified thermal conductivity of 9.2 W/m·K. Actual results depend on assembly and application conditions.
Surface Gap Filling
Helps fill microscopic surface gaps between a component and its heat sink when correctly applied.
Computing Systems
Intended for evaluation in suitable computing and electronic thermal-interface applications.
HTX-900 Technical Specifications
Review the available product information before selecting a thermal interface material for your application.
| Product Name | HTX-900 Thermal Paste |
|---|---|
| Product Series | HTX Series |
| Material Type | Thermal Paste |
| Thermal Conductivity | 9.2 W/m·K |
| Colour | Grey |
| Operating Temperature | -40°C to +200°C |
| Electrical Properties | Non-Conductive |
| Packaging Options | Multiple option |
Thermal Management Applications
HTX-900 can be evaluated for suitable thermal interfaces in computing and electronic equipment, subject to application requirements and compatibility.
HTX-900 Technical Documentation
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Technical Data Sheet
Product specifications, test information and technical details for HTX-900 Thermal Paste.
View TDS on Downloads Page ↗Material Safety Data Sheet
Check the availability of HTX-900 safety documentation and product handling information.
View MSDS on Downloads Page ↗Looking for HTX-900 Thermal Paste?
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Technical note: Product specifications should be verified against the latest applicable TDS. Actual thermal performance depends on application method, interface thickness, contacting surfaces and operating conditions.