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HTX-600 Thermal Paste
High-Performance Thermal Interface Material
Coolxpert HTX-600 is a thermal interface paste developed for thermal management applications in compatible electronic and electrical assemblies. Applied between a heat-generating component and a heat sink, it helps fill microscopic surface irregularities to support heat transfer across the interface.
Designed for Thermal Management
A thermal interface material for assemblies where heat transfer between a component and heat sink is an important part of system design.
Thermal Transfer
Specified thermal conductivity of 6.3 W/m·K. Actual results depend on the assembly, interface thickness and operating conditions.
Surface Gap Filling
Helps fill microscopic surface irregularities between compatible components and heat sinks when correctly applied.
Electronic Assemblies
Can be evaluated for suitable electronic and electrical thermal-management applications subject to product compatibility.
HTX-600 Technical Specifications
Review the available product information before selecting this thermal interface material for your application.
| Product Name | HTX-600 Thermal Paste |
|---|---|
| Product Series | HTX Series |
| Material Type | Thermal Paste |
| Thermal Conductivity | 6.3 W/m·K |
| Colour | Grey |
| Operating Temperature | -20°C to +150°C |
| Electrical Properties | Non-Conductive |
| Packaging Options | Multiple options |
Thermal Management Applications
HTX-600 can be evaluated for suitable thermal interfaces in electronic and electrical equipment, subject to design requirements and compatibility.
HTX-600 Technical Documentation
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Technical Data Sheet
Check the available specifications, test information and technical details for HTX-600 Thermal Paste.
View TDS on Downloads Page ↗Material Safety Data Sheet
Check the availability of HTX-600 safety documentation and product-handling information.
View MSDS on Downloads Page ↗Looking for HTX-600 Thermal Paste?
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Technical note: Product specifications should be verified against the latest applicable TDS. Actual thermal performance depends on application method, interface thickness, contacting surfaces and operating conditions.